TSMC's second wafer fab in Kumamoto, Japan, will start production in the first half of 2029.

According to Japanese media, TSMC's second wafer fab being constructed in Kikuyo-cho, Kumamoto Prefecture, Japan, will have its production start date delayed from the original target of the end of 2027 to the first half of 2029. Earlier this year, TSMC had announced a delay in groundbreaking due to local transportation issues, and the latest plan indicates that construction will be postponed to the second half of 2025. The first fab in Kumamoto began production at the end of 2024, mainly producing automotive logic chips and image sensors using 12 to 28 nanometer process technology.