TrendForce Consulting expects the market size of foldable phone hinges to reach $1.2 billion by 2025.

According to the latest research from TrendForce, driven by market expectations for Apple to launch a foldable product in the second half of 2026, the penetration rate of foldable smartphones is expected to increase from 1.6% in 2025 to over 3% in 2027. The technical evolution of foldable smartphones, from the assembly of multiple components and hinges to integrated structural design, has helped make devices lighter and thinner through breakthroughs in materials, structure, and thickness. The development of hinge technology has become a key focus of competition. The foldable smartphone hinge market is expected to reach $12 billion in 2025. TrendForce reports that Samsung started using a teardrop-shaped hinge in its Galaxy Z Fold 5 and Flip series from 2023 to improve folding smoothness and durability while reducing crease marks. This design quickly became mainstream in the industry, not only increasing the proportion of hinges in the overall value of the devices but also driving steady market expansion. It is estimated that the global foldable smartphone hinge market value will reach $12 billion in 2025, with hinges currently accounting for about 5% to 8% of the BOM cost of a single device. To reduce costs and improve yield rates, the industry is accelerating the simplification of designs through modularization, mortise-and-tenon structures, and laser welding, and moving towards standardization of sizes and components. This trend will encourage hinges to shift from traditional material processing to system module supply, speeding up overall assembly efficiency and optimizing supply chain profit structures. Suppliers have increased their investments, with companies like Nippon Electric and Amphenol providing high-precision rotating shafts and metal components to meet the demand for teardrop-shaped hinges and introduce standardized production processes. Advanced materials groups like Dongmu New Materials Group and Jiangsu Gian Technology are solidifying their position in the foldable smartphone market with powder metallurgy and precision machining, especially in the mid-range product lines where they have significant price and mass production advantages. Apple may introduce new materials, supply chain expected to upgrade and integrate As Apple's entry into the foldable device market approaches, there is a high level of interest in the new materials and suppliers it may use. It is understood that Apple is considering using liquid metal for structural components to ensure products are both lightweight and durable. Chinese manufacturers such as Dongguan Eontec already have the capability for liquid metal forming. If Apple further incorporates 3D printing, composite materials, and special processes, it will inevitably drive a comprehensive upgrade of the high-end structural component supply chain. Apple has historically been a leader in non-industrial innovation, opting for an "Early Majority" strategy to enter the market, waiting for the foldable smartphone market to stabilize before quickly capturing market share in a differentiated way to avoid the risks and high R&D costs of early investment. Apple's entry into the market signifies the maturity of foldable smartphones, with core competition shifting to manufacturing efficiency, cost control, and supply chain integration. In the face of the new stage of design simplification and cost pressure, suppliers who can simultaneously master technology, capacity, and provide price elasticity will be key beneficiaries of the next growth cycle.