Fangzheng Securities: The AI terminal explosion is just around the corner, and the semiconductor side is ushering in a big AI opportunity.

Fangzheng Securities released a research report stating that as the technology of miniaturizing models becomes more mature, the computing power, storage capacity, and connectivity of various hardware links continue to upgrade. The outbreak of AI terminals is imminent. Although domestic manufacturers of mainstream edge computing chips such as AI smartphones and AIPC started relatively late, there is great potential for domestic manufacturers in edge AIOT computing power, storage technology, and wireless connectivity chip directions. They are expected to achieve overtaking on the inside track. It is worth noting that under the trend of edge AI, excellent companies in each track have excellent capabilities for cross-track integration, such as storage-computing integration and AI-connected chips with computing power. It is recommended to pay attention to the three core areas of edge computing power SOC, edge storage capacity, and edge connectivity.