Local banks are issuing a large number of sci-tech innovation bonds.

Recently, many local banks have issued bonds for technology and innovation. On September 19th, Qingdao Bank successfully issued "25 Qingdao Bank Technology and Innovation Bonds" with a total issuance size of 10 billion yuan. Chongqing Three Gorges Bank also issued its first technology and innovation bond, "25 Three Gorges Bank Technology and Innovation Bonds 01", with a total issuance size of 20 billion yuan from September 22nd to 24th. According to Wind Information data, as of September 23rd, a total of 54 technology and innovation bonds have been issued by banks this year, with a total issuance size of 271 billion yuan. More than 30 local banks have participated in these issuances, becoming an important force in expanding the technology and innovation bond market.