Tong Fu Microelectronics: The company's optoelectronic hermetic sealing products have passed preliminary reliability testing.

Tongfu Microelectronics released an announcement regarding the Investor Relations Activity Record Form, stating that in the first half of the year, the company made significant progress in the development of large-size FCBGA. Among them, large-size FCBGA has entered the mass production stage, while extra-large FCBGA has completed preliminary research and entered the formal engineering assessment stage. At the same time, the company has solved the product warping and heat dissipation issues in the extra-large size through product structure design optimization, material selection, and process optimization. In addition, the company has made breakthrough progress in the technical research and development of optoelectronic packaging, and the related products have passed preliminary reliability tests.