Report: TSMC plans to use 12-inch single crystal silicon carbide for heat dissipation carriers.

Some media reports claim that TSMC is actively recruiting "heroes" to call on equipment manufacturers and compound semiconductor-related manufacturers to participate, planning to apply 12-inch single crystal silicon carbide to heat dissipation carriers, replacing traditional aluminum oxide, sapphire substrates or ceramic substrates. At the same time, there are reports that Nvidia also plans to use silicon carbide substrates as an intermediary layer material in the advanced packaging process of the new generation GPU chips.