The Tongkun Group's 8th phase of innovative bonds with a total value of 500 million was successfully issued in 2025.

On April 25, 2024, the board of directors of Tongkun Corporation approved the issuance of short-term financing notes. After obtaining approval from the shareholders' meeting, the company obtained a registered quota of 6 billion yuan from the Dealers' Association on August 30. On September 10, 2025, the company issued the eighth series of technology innovation bonds for the year 2025 in the national interbank market, with a total issuance amount of 500 million yuan. The funds were fully received on September 11. The bond is abbreviated as "25 Tongkun SCP008", with a maturity of 260 days and an issuance interest rate of 1.84%. In terms of subscription, there were 8 compliant subscribers with a total amount of 920 million yuan; and 6 effective subscribers with a total amount of 570 million yuan.