Hegang Group's 10 billion yuan small public offering bond project accepted by Shenzhen Stock Exchange

The progress information of the Shenzhen Stock Exchange shows that the status of HBIS Group Co., Ltd.'s 10 billion yuan small public bond project has been updated to "accepted", with the update date being July 11, 2025. The prospectus application draft shows that the total registered amount of this bond issue does not exceed 10 billion yuan and will be issued in stages. The funds raised from this bond issuance, after deducting issuance expenses, will be used for productive expenditures, including debt repayment, supplementing working capital, project investment, equity investment, or asset acquisition, in compliance with national laws and regulations. The specific use of funds will be determined based on the issuer's funding needs.