Proud to announce: Recently received bulk orders from leading semiconductor companies for head components.

According to Jiaocheng Ultrasonic News, recently, Jiaocheng Ultrasonic has received bulk orders from top clients in the semiconductor packaging industry, including wire bonding machines, PIN needle ultrasonic welding machines, ultrasonic scanning microscopes and other equipment. Among them, the wire bonding machine has received bulk orders, successfully achieving domestic substitution.