Lates News

Micron Technology announced that the HBM3E 12-layer stack 36GB memory has been incorporated into AMD's latest MI350 series, adding another major client after entering the market with NVIDIA. Micron emphasized that this cooperation highlights the crucial roles of energy efficiency and performance in training large AI models, providing high bandwidth inference, and processing complex high-performance computing workloads such as data processing and computational modeling. This is another significant milestone for Micron in its industry-leading position in the HBM sector.