Guangzhou Huangpu: Encouraging the development of high-end semiconductor and sensor materials to create China's third pole core carrier area for the integrated circuit industry.

The Guangzhou Development Zone and Huangpu District have issued a series of policies and measures to support the high-quality development of the integrated circuit industry, aiming to help create the third pole of China's integrated circuit industry. The policies include optimizing the industrial development layout, achieving breakthroughs in areas such as chip design, specialty processes, advanced packaging testing, EDA tools, equipment, and components, and building a comprehensive integrated circuit industry cluster covering design, manufacturing, materials, equipment and components, packaging testing, and other links. They also encourage the development of high-end semiconductor and sensor manufacturing materials such as photomasks, electronic gases, photoresists, polishing materials, and high-purity targets. The policies involve actively introducing key domestic basic material enterprises to steadily increase key basic material supply capabilities. Key efforts will be focused on continuous research and development and technological innovation in key components and system integration for integrated circuit manufacturing, supporting domestic alternatives for equipment, key components, and tools such as lithography, cleaning, etching, ion implantation, and deposition. The policies also aim to improve the investment and financing environment, seeking support from national, provincial, and municipal integrated circuit funds. They also highlight the importance of utilizing funds from the district's science and technology innovation investment fund and other fund platforms to support state-owned funds and increase cooperation with integrated circuit companies.