ICBC announced the issuance of 20 billion yuan in technology innovation bonds

Industrial and Commercial Bank of China (ICBC) announced on May 9 that it was the first to launch the initial batch of technology innovation bonds. On the same day, the Technology Innovation Bonds were officially launched on the Interbank Bond Market, which was sponsored by the China Foreign Exchange Trade System & National Interbank Funding Center and hosted by the Beijing Financial Assets Exchange. ICBC stated that the size of this issuance of technology innovation bonds is 20 billion yuan, making it the largest financial technology innovation bond issuance in the first batch. Among the 36 technology-oriented enterprises and equity investment projects announced in the first batch, ICBC is the lead underwriter for 12 projects.