Shenzhen Stock Exchange: Further supports the issuance of technology innovation bonds, and adds support for commercial banks and other financial institutions to issue technology innovation bonds.

According to the Securities Times APP, on May 7th, the Shenzhen Stock Exchange issued a notice entitled "Notice on Further Supporting the Issuance of Technology Innovation Bonds to Serve New and Quality Production Forces". It proposes to further expand the scope of issuers and the use of funds raised, and to increase the coverage of financial services for technology. It also includes support for financial institutions to issue technology innovation bonds. In addition to continuing to support issuers from the technology innovation, technology upgrade, technology investment, and technology incubation sectors in issuing technology innovation bonds, it also adds support for financial institutions such as commercial banks, securities companies, and financial asset investment companies to issue technology innovation bonds. They will leverage their professional advantages in investment and financing services, lawfully use funds raised for loans, equity, bonds, fund investments, capital intermediary services, and other avenues, specifically to support businesses in the field of technology innovation.