XingSen Technology: The FCBGA packaging substrate project is currently in the stage of market expansion and small batch production.

Xingxin Technology stated on the Shenzhen Stock Exchange interactive platform that the company's FCBGA packaging substrate project is currently in the stage of market expansion and small-scale production, and the company will start expanding production as needed based on market demand. In addition, the company stated that the yield of FCBGA packaging substrate is continuously improving, and the testing of FCBGA packaging substrate with more than 20 layers is progressing in an orderly manner.