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Home > Latest

Lates News

date
30/09/2026
The China Earthquake Networks Center has officially determined that a magnitude 5.5 earthquake occurred in the waters east of Taiwan at 13:00 on September 30, with a focal depth of 10 kilometers.
Latest
6 m ago
SK hynix expands outsourced flip-chip packaging for memory semiconductors. Following OSAT (outsourced semiconductor assembly and test) supplier A-PROTECH, SK hynix has begun outsourcing more business to WINPAC, marking the two companies' first collaboration in four years. SK hynix plans to assign packaging orders for some DDR4 and DDR5 DRAM memory chips to Winpac. Winpac has completed equipment commissioning and other production line readiness at its P-area packaging plant and has now entered mass production. This area handles the packaging of high-performance products such as DRAM, NAND flash, and eUFS embedded universal flash storage, with monthly capacity increased from 44 million units to 50 million units.
10 m ago
Main capital flows: Chip concept sector sees net outflow exceeding 15.9 billion.
11 m ago
Sources: AMD CEO Lisa Su to visit South Korea next month
12 m ago
UK Prime Minister Burnham: Cutting welfare spending will enable the UK to meet its defence targets.
13 m ago
Spanish company Asterion will shut down its solar business.
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