Lates News

SK hynix expands outsourced flip-chip packaging for memory semiconductors. Following OSAT (outsourced semiconductor assembly and test) supplier A-PROTECH, SK hynix has begun outsourcing more business to WINPAC, marking the two companies' first collaboration in four years. SK hynix plans to assign packaging orders for some DDR4 and DDR5 DRAM memory chips to Winpac. Winpac has completed equipment commissioning and other production line readiness at its P-area packaging plant and has now entered mass production. This area handles the packaging of high-performance products such as DRAM, NAND flash, and eUFS embedded universal flash storage, with monthly capacity increased from 44 million units to 50 million units.