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Home > Latest

Lates News

date
30/09/2026
An earthquake occurred in the waters east of Taiwan. Based on preliminary seismic parameters, the Tsunami Warning Center of the Ministry of Natural Resources has determined that this earthquake will not trigger a tsunami.
Latest
4 m ago
General Motors introduces Buick to South Korea with the debut of the Electra E7 plug-in hybrid SUV.
4 m ago
CAICT's Institute of Cloud Computing and Digitalization releases the "Research Report on the Token Economy Development"
7 m ago
GAC Toyota: Huang Jian, President of the Trumpchi BU, returns to GAC Toyota as the Chinese-side head.
9 m ago
Thailand revises industrial output index to include AI-related industries, reflecting capacity boom
10 m ago
SK hynix expands outsourced flip-chip packaging for memory semiconductors. Following OSAT (outsourced semiconductor assembly and test) supplier A-PROTECH, SK hynix has begun outsourcing more business to WINPAC, marking the two companies' first collaboration in four years. SK hynix plans to assign packaging orders for some DDR4 and DDR5 DRAM memory chips to Winpac. Winpac has completed equipment commissioning and other production line readiness at its P-area packaging plant and has now entered mass production. This area handles the packaging of high-performance products such as DRAM, NAND flash, and eUFS embedded universal flash storage, with monthly capacity increased from 44 million units to 50 million units.
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