Armor Hero officially delivers 332-layer BiCS10 flash memory samples: Storage density and power consumption soar, aiming for AI computing "memory wall".

According to the Wise Finance APP, on July 3rd, the Japanese storage chip giant Kioxia Holdings officially announced that it has started delivering samples of its tenth generation BiCS FLASH 3D flash memory chips to major AI data center operators. This 1Tb TLC (Triple-Level Cell) flash memory chip, which adopts a 332-layer stacked architecture, is exclusively produced by Kioxia at its Fab2 wafer factory in Kitakami, Iwate Prefecture, Japan. This marks a key advancement for the former Toshiba Memory Division's business in the new AI-driven storage "super cycle".