New composite materials are being used on a large scale for the first time in the field of heat control of computing chips.

Reporters learned from the Ningbo Institute of Materials Technology and Engineering of the Chinese Academy of Sciences that recently, the diamond/copper high thermal conductivity composite material product prepared by the institute's functional carbon material team has been successfully deployed in cluster on the national supercomputing internet core node major scientific and technological platform. This is the first large-scale global application of this material in the field of thermal control for computing chips.