New stock news | Lontium Semiconductor Corporation (688486.SH) has submitted a secondary listing application to the Hong Kong Stock Exchange, becoming mainland China's top-ranked fabless design company in the video bridge chip market.
According to the prospectus, Longsun Holdings is a recognized fabless high-speed mixed-signal chip design company, dedicated to upgrading the data transmission and video processing infrastructure for intelligent terminals, devices, and AI applications.
According to the disclosure of the Hong Kong Stock Exchange on June 30, Lontium Semiconductor Corporation (Hefei) Co., Ltd. (referred to as Lontium Semiconductor Corporation (688486.SH)) has submitted an application for listing on the main board of the Hong Kong Stock Exchange, with China Securities Co., Ltd. International as the exclusive sponsor. The company had previously submitted a listing application to the HKEX on December 22, 2025.
Company Profile
According to the prospectus, Lontium Semiconductor Corporation is a recognized fabless high-speed mixed-signal chip design company, dedicated to upgrading the data transmission and video processing infrastructure for intelligent terminals, devices, and AI applications. Lontium Semiconductor Corporation's reachable market mainly includes two divisions: interconnect chips and intelligent video chips. With three foundational technologies, including (i) high-bandwidth serializers/deserializers (SerDes), (ii) high-speed interface protocol processing and data encryption, and (iii) high-definition (HD) audio-video processing and display driver technologies, Lontium Semiconductor Corporation's products enable efficient data processing, transmission, and format conversion between computing, storage, and display units. Major applications include intelligent visual terminals, intelligent vehicular, AR/VR devices, and AI and high-performance computing (HPC).
Lontium Semiconductor Corporation's chips integrate high-definition video processing and display capabilities, as well as intelligent sensing and human-machine interaction technologies, establishing a solid technical foundation to support future edge AI-driven applications. According to Frost & Sullivan data, based on 2025 revenue, in the video bridging chip market, Lontium Semiconductor Corporation ranks as the top fabless design company in Mainland China, with a market share of 4.1%, while video bridging chips are an important part of mixed-signal chips.
High-definition audio-video data serves as a crucial bridge connecting the physical and digital worlds. The high-speed and stable transmission of such data in applications like Siasun Robot & Automation, drones, AR/VR devices, autonomous driving systems, and high-performance computing systems relies on three foundational technologies. Lontium Semiconductor Corporation's R&D investment in these core technologies over the past two decades has solidified the era of intelligent vision. With high-bandwidth SerDes technology, Lontium Semiconductor Corporation has expanded into a wider range of interconnect chip areas, including key interconnect components like PCIe/CXL/USB Retimers and Switches, meeting the multi-modal data transfer bottlenecks in complex HPC and AI environments, including vertical scaling architecture (within GPU clusters), horizontal scaling architecture (data centers), and cross-system architecture (between data centers).
Lontium Semiconductor Corporation's chips meet the demands of major application scenarios, including: (i) intelligent visual terminals, (ii) intelligent vehicular, (iii) AR/VR, and (iv) AI & HPC. The company provides end-to-end solutions encompassing collection, connection, processing, and display capabilities. As of December 31, 2025, Lontium Semiconductor Corporation's product portfolio includes 169 intelligent video chips and 120 interconnect chips, facilitating the flow of data across heterogeneous systems. Lontium Semiconductor Corporation has established a collaborative ecosystem that leverages user application feedback and strategic partnerships (including reference design collaborations with global semiconductor leaders) as drivers of continued technological iteration and solution enhancement.
Financial Information
Revenue
For the fiscal years 2023, 2024, and 2025, the company achieved revenues of approximately RMB 3.23 billion, RMB 4.66 billion, and RMB 5.68 billion, respectively.
Gross Profit
For the fiscal years 2023, 2024, and 2025, the company recorded gross profits of approximately RMB 1.73 billion, RMB 2.53 billion, and RMB 3.01 billion, respectively.
Net Profit
For the fiscal years 2023, 2024, and 2025, the company's net profits were approximately RMB 1.03 billion, RMB 1.44 billion, and RMB 1.72 billion, respectively.
Industry Overview
In terms of market size, the global semiconductor chip market continues to expand, driven by the increasing demand for high-performance electronic systems in automotive, intelligent terminal, and industrial applications. The semiconductor industry is a market worth tens of trillions of RMB, with strong growth momentum. Integrated circuits, as the most valuable and critical category, accounted for 88% of the total semiconductor market size in 2025. In the field of integrated circuits, mixed-signal chips play a crucial role, with a market share of 16% of the integrated circuit market.
The company's reachable market includes two divisions: interconnect chips and intelligent video chips, which are two important sub-segments of the global semiconductor chip market. The total market size of the company's reachable market increased from RMB 169.8 billion in 2021 to RMB 260.5 billion in 2025, and is expected to further increase to RMB 633.8 billion by 2030. In terms of market share, interconnect chips and intelligent video chips together accounted for 4.7% of the global semiconductor market in 2021, rising to 5.4% in 2025, and expected to increase to 8.2% by 2030.
Board of Directors
The board of directors will consist of six directors, including two executive directors, one non-executive director, and three independent non-executive directors.
Equity Structure
As of the last practicable date, Mr. Feng Chen holds 37.67% of the company (excluding treasury shares), and Chipwealth holds 3.32% (excluding treasury shares), with Mr. Chen serving as the sole executive partner of Chipwealth (with the authority to exercise all voting rights held by Chipwealth). According to the voting rights proxy agreement, Ms. Chengying Qiu's shares' corresponding voting rights have been irrevocably delegated to Mr. Chen, accounting for 3.46% of the voting rights as of the last practicable date (excluding treasury shares). Therefore, as of the last practicable date, Mr. Chen has the right to exercise a total of 44.45% of the voting rights at the company's shareholders' meeting (excluding treasury shares). Under listing rules, Mr. Chen and Chipwealth together will constitute a group of controlling shareholders.
Intermediary Team
Sole Sponsor: China Securities Co., Ltd. (International) Financing Limited
Company Legal Advisers: Pu Heng Law Firm (Hong Kong) LLP, Jin Tiancheng Law Firm in Shanghai
Sole Sponsor Legal Advisers: Guo Weiyan Law Firm, Deheng Law Firm
Auditor and Reporting Accountant: Ernst & Young LLP
Industry Consultant: Frost & Sullivan Consulting (Beijing) Co., Ltd. Shanghai Branch
Compliance Adviser: Hotcapital Limited
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Guosen: The core competitiveness of scenic spots is shifting towards operational capability. In the short term, we should focus on the summer window from June to August.

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