Five companies, including Jiyiwei and Zhuolei Laser, have changed their status in the science and technology innovation board IPO review to "accepted".

On June 30th, a total of 5 companies including Ji Yiwei, Zhuo Lei Laser, Huazhuo Jingke, Tongchuang Purun, and Tianke Heda have had their IPO review status on the Shanghai Stock Exchange Science and Technology Innovation Board changed to "accepted." Ji Yiwei is underwritten by Guotai Haitong, and plans to raise 3 billion yuan. Their prospectus shows that Ji Yiwei was established in 2019 and is mainly engaged in the research, design, and sales of high-speed interconnect chips, IP, and related custom chips, widely used in areas such as artificial intelligence, data centers, network telecom, and wireless base stations. Zhuo Lei Laser is underwritten by Sinolink, and plans to raise 1.161 billion yuan. Their prospectus shows that Zhuo Lei Laser is mainly engaged in the research, production, and sales of high-end pulse lasers represented by ultrafast lasers and high-energy lasers. The company is one of the few comprehensive laser manufacturers in the industry with a dual driving force of "ultrafast + high energy" and is one of the earlier companies in China to conduct research and industrialization of core technology of ultrafast lasers. They focus on multiple application areas with a core of semiconductors, national defense and military industry, and scientific research, and actively layout future key industrial areas represented by controlled nuclear fusion. Huazhuo Jingke is underwritten by CMSC, and plans to raise 3.5 billion yuan. Their prospectus shows that Huazhuo Jingke is a leading domestic supplier of integrated circuit specialized equipment and key components, mainly engaged in the research, production, and sales of semiconductor specialized equipment and parts. Since its establishment, the company has focused on technological research and industrialization based on ultra-precision measurement and control technology as the core technology platform, possessing the capability of industrialization for various key advanced semiconductor equipment and parts. Their products and technology are widely used in integrated circuit manufacturing and advanced packaging production lines, providing technical solutions for process such as heat treatment, bonding, quantity detection, etching, film deposition, ion implantation, etc. Tongchuang Purun is underwritten by Guotai Haitong, and plans to raise 1.5 billion yuan. Their prospectus shows that Tongchuang Purun is specialized in the research, production, and sales of advanced metal materials, with production capacity of 4N5-6N tantalum, 7N copper, 6N aluminum, 5N manganese and other ultra-high purity electronic-grade metal materials. They have formed two major product lines of ultra-high purity metal materials and high-purity high-performance metal materials, with core technology, equipment design and development capability, and production process under control. The ultra-high purity metal materials serve the large-scale integrated circuit manufacturing and advanced display industries, supporting China's semiconductor industry supply chain security and independent control, and have entered the global advanced process chip supply chain; high-purity high-performance metal materials have wide applications in high-end equipment manufacturing, artificial intelligence power centers, new energy vehicles, aerospace, national defense and military industries, providing support for the development of national strategic emerging industries and the construction of major scientific and technological innovation system. Tianke Heda is underwritten by CICC, and plans to raise 2.78 billion yuan. Their prospectus shows that Tianke Heda focuses on the research, production, and sales of third-generation semiconductor materials silicon carbide substrates and related products, being one of the earliest companies in China to achieve industrialization of silicon carbide substrates. After twenty years of technological breakthroughs and industrialization practices, the company has broken the long-term monopoly of overseas manufacturers on silicon carbide substrates, and has become one of the global leading companies in the field of silicon carbide materials. Since 2023, their core product of conductive silicon carbide substrates has consistently ranked in the top three globally. Based on the deep accumulation in the field of silicon carbide substrates, the company has strategically extended downstream to silicon carbide epitaxy business, building a rare "substrate + epitaxy" integrated delivery system in the industry, which directly responds to and deeply collaborates with the core needs of downstream device manufacturers.