Japanese Prime Minister Shiba Shigeru: Will provide over $65 billion in subsidies for the semiconductor and AI industries in the next decade.

Japanese Prime Minister Shigeru Ishiba has promised to provide over $65 billion in support for Japan's semiconductor and artificial intelligence industries over the next decade. Ishiba stated that he aims to provide over 10 trillion yen (approximately $65.1 billion) in subsidies for the semiconductor and artificial intelligence industries by the fiscal year 2030, serving as a catalyst to generate over 50 trillion yen in public and private investments over the next ten years. Ishiba also expressed his desire to promote positive examples of regional revitalization, such as the TSMC Kumamoto chip factory, nationwide. Ishiba stated that he will discuss the financing of the plan with various departments, but he will not foot the bill for these measures through deficit financing bonds. Earlier reports indicated that the Japanese government is exploring new ways to provide funding for the Japanese semiconductor industry, with the Ishiba government planning to issue bonds backed by its assets (including NTT shares) to provide subsidies to semiconductor companies. Japan had previously allocated approximately 4 trillion yen in additional budget for revitalizing its semiconductor industry, including 920 billion yen in funding provided to Rapidus, which aims to mass-produce advanced logic chips by 2027.