The next generation of Beidou-3 short message communication system-on-chip (SoC) chip is launched at the International Summit of Beidou Scale Application.

On September 24th to 25th, the 4th Beidou Scale Application International Summit opened grandly in Zhuzhou, Hunan. The summit was jointly organized by the National Development and Reform Commission, the National Internet Information Office, the Ministry of Industry and Information Technology, the Ministry of Transport, and the People's Government of Hunan Province, with the theme "With the World, Sharing Beidou - Intelligent Connection in Time and Space", aiming to promote the Beidou system to reach new heights in marketization, industrialization, and internationalization. At this summit, Huada Beidou launched the new generation Beidou-3 short message communication SoC chip HD6180, and showcased a variety of chips, modules, and rich chip-level solutions in a 130 square meter exhibition area, demonstrating its strength in the field of Beidou high-precision positioning and short message communication.