Lates News

date
16/09/2025
Tencent Group's Senior Executive Vice President and CEO of Cloud and Smart Industries Business Group, Tang Daosheng, stated that Tencent has been collaborating with multiple chip manufacturers to adapt different types of models, ranging from several hundred billion to several billion bytes. Different scenarios require different configurations of chips. Tencent will maintain an open attitude and collaborate with various chip manufacturers on some customized adaptations. (Yicai)