iPhone 17 Pro series may be the first to use VC cooling technology

The journalist learned from informed sources that the iPhone 17 Pro series will introduce VC vapor chamber design for the first time, replacing the graphene heat dissipation sheet currently used in iPhones to improve the phone's heat dissipation performance, with Raytron Technology as its supplier. The rumor suggests that the iPhone 17 Pro Max may adopt a horizontal motherboard design. With the support of the vapor chamber, the heat emitted from the back of the phone will be spread out. With improved heat dissipation performance, the iPhone 17 Pro is expected to fully utilize the performance of the chip and reduce situations of frequency reduction caused by high device temperatures.