SK Hynix launches high thermal efficiency mobile DRAM products to address overheating issues in smartphones.

SK Hynix said on Thursday that it has started supplying high-efficiency heat-dissipating mobile dynamic random-access memory (DRAM) products to address the increasing power consumption of artificial intelligence devices. SK Hynix stated that the new products use an epoxy resin molding compound, which is a material used to protect chips from water, heat, and impact. The company said, "Due to the heat generated by AI applications on devices during fast data transmission, which leads to a decrease in the performance of smartphones, this technology was developed. We expect this to help solve the heat issues of high-performance flagship smartphones."