Guangdong: The issuance of technology innovation bonds achieves "full coverage" of three types of entities.

According to the Guangdong Branch of the People's Bank of China, since the launch of the "technology board" in the bond market three months ago, the Guangdong Branch of the People's Bank of China has taken multiple measures to support financial institutions, technology-based enterprises, and equity investment institutions in issuing technology innovation bonds, in order to leverage the financial liquidity in the bond market to support the high-quality development of technology innovation. As of August 18, 2025, a total of 441.05 billion yuan of technology innovation bonds have been issued in the interbank market by 2 financial institutions, 12 technology-based enterprises, and 4 equity investment institutions in Guangdong Province, achieving "full coverage" of the three types of entities. In the process of promoting the issuance of technology innovation bonds, the Guangdong Branch of the People's Bank of China has focused on supporting private enterprises and key areas of development, guiding and promoting TCL Technology Group Co., Ltd. to issue two tranches of technology innovation bonds totaling 30 billion yuan, and Jinfeng Technology Co., Ltd. to issue 10 billion yuan. Furthermore, the branch has also promoted China Southern Power Grid Co., Ltd. to simultaneously issue two technology innovation bonds totaling 75 billion yuan, one of which has a dual attribute of "green + technology innovation", providing strong support for the development of green technology.