Shengyi Electronics: Intends to invest approximately 1.9 billion yuan in a high-density multilayer high-performance computing circuit board project for smart manufacturing.

Shengyi Electronics announced plans to invest a total of approximately 1.9 billion yuan in the intelligent manufacturing high multi-layer computing power circuit board project, which includes the factory construction and equipment costs already invested in the Ji'an Phase II project, with an additional investment of about 1.75 billion yuan. The project will be implemented in two phases, with a total construction period of 2.5 years, and trial production is expected to begin in 2026 and 2027 respectively. The project focuses on meeting the needs of the high-end market such as servers, high multi-layer network communications, and AI computing power. The funds will come from self-owned or self-raised funds. The implementation of the project may face risks such as policy adjustments, project approvals, and uncertainties such as lower-than-expected market demand growth.