AI Electronics: Plans to issue convertible bonds to raise no more than 1.901 billion yuan for multiple research and development and industrialization projects.

Ai Electronics announced that the company plans to issue convertible corporate bonds to raise funds of up to 1.901 billion yuan for the construction of a global R&D center project, edge AI and accompanying chip R&D and industrialization projects, in-vehicle chip R&D and industrialization projects, and motion control chip R&D and industrialization projects. Among them, the total investment for the global R&D center construction project is 1.485 billion yuan, and it is proposed to use 1.224 billion yuan of the funds raised.