Fudan Microelectronics: Signed a technology service contract with Fudan University, with a contract amount of 3.5 million yuan.

Fudan Microelectronics announced that the company has signed a technical service contract with Fudan University, commissioning Fudan University to research and develop ultra-large-scale FPGA layout wiring technology and provide corresponding technical support, with a contract amount of 3.5 million RMB. This transaction falls under the category of accepting services from related parties, constituting a related party transaction.