The Step-by-Step Star Alliance has joined forces with nearly 10 chip manufacturers to launch the Modem Core Ecological Innovation Alliance.

At the Step 3 model launch event of Leap High Technologies, Leap High Technologies, in collaboration with nearly 10 chip manufacturers, launched the "Model-Chip Eco Innovation Alliance." The first batch of members include Huawei Ascend, Muxi, Tiensu Zhixin, Saddle Technology, Birun Technology, Cambricon, Moore Threads, Wuxin Xinqu, Silicon Movement, etc. Currently, Huawei Ascend chips have been the first to achieve the deployment and operation of Step 3. Muxi, Tiensu Zhixin, Saddle and others have also preliminarily achieved the operation of Step 3. The adaptation work of other alliance manufacturers is underway. Meanwhile, the four leading figures in the domestic chip industry appeared at the roundtable forum of the Leap High Technologies Step 3 model launch event. Muxi founder, chairman and general manager Chen Weiliang, Tiensu Zhixin chairman and CEO Gai Lujiang, Saddle Technology founder, chairman and CEO Zhao Lidong, and Birun Technology founder, chairman and CEO Zhang Wen appeared on stage together for the first time, discussing "collaborative innovation between large models and chips."