Shenzhen has issued 14 technology innovation bonds with a total size exceeding 20 billion yuan.

According to the Shenzhen branch of the People's Bank of China, since the launch of technology innovation bonds on May 7 this year, as of July 15, 2025, Shenzhen has had 9 technology-based enterprises and equity investment institutions issue 14 technology innovation bonds in the interbank market, with a total size of 20.75 billion yuan. The Shenzhen branch of the People's Bank of China has also cooperated with the Shenzhen Municipal Finance Bureau to explore "seed fund + seed loan", assisting 153 early-stage technology companies to obtain loans totaling 130 million yuan.