The first issuance of securities dealers' science and technology innovation corporate bonds in the interbank bond market.

Recently, CITIC Securities announced that it plans to issue CITIC Securities Co., Ltd.'s 2025 Technology Innovation Bonds on the interbank market. The basic issuance size of this bond is 500 million yuan, with an additional 500 million yuan of over-allotment rights, a term of 5 years, and the issuance date/bookkeeping date is June 26, 2025. This fundraising will support technology innovation through various methods such as equity, bond, fund investments, and capital intermediary services. It is reported that this is the first securities firm technology innovation bond issued in the interbank market, effectively expanding the issuance channels for securities firm technology innovation bonds.