Industry insiders: Establishing risk-sharing tools for technology and innovation bonds can alleviate the difficulty in fundraising in the equity investment market.

On June 19, according to the China Foreign Exchange Trading System, the first batch of projects using technology innovation bond risk-sharing tools have officially launched. Industry insiders believe that the establishment of technology innovation bond risk-sharing tools can alleviate the difficulty of socialized fundraising in the equity investment market, and enhance the ability of top venture capital institutions to raise long-term stable funds. The creation of risk-sharing tools can significantly improve the accessibility and convenience of bond financing for private enterprises, credit-challenged early-stage and growth-stage technology innovation enterprises, and equity investment institutions. The bond market's "technology board" has initially connected the "stock-bond-loan" linkage through mechanisms such as risk sharing and fund transmission chains. Possible future measures include innovations in stock-bond linkages tools, designing bonds with special clauses to alleviate short-term debt repayment pressure for enterprises and provide investors with value-added opportunities.