Winbond Electronics Corp.: the mass production of over 200 analog chips is expected by the end of the year.

On May 21st, the institutional research notes disclosed by Unigroup Technology revealed that this year is an important year for the company's semiconductor business to release a batch of new product numbers. Starting from the first quarter, the company has released a series of new products, especially focusing on the accelerated pace of new product releases around high-value product numbers such as third-generation analog. The 8-inch SiC and GaN production lines that the company started building last year have now completed equipment installation. In terms of analog chip products, the company has recently released a series of new products focusing on two core application scenarios: AI power and automotive standards, and has accelerated customer certification and introduction. It is expected that by the end of 2025, the company will achieve over 200 production-ready analog chip product numbers.