Lates News

Banking institutions continue to issue technology innovation bonds, and bond funds are flowing rapidly into technology innovation enterprises. On May 16, Shanghai Bank will issue the first tranche of technology innovation bonds due in 2025 with a scale of 5 billion yuan. According to public information from China Money, as of May 14, nine banks have issued announcements related to the first tranche of 2025 technology innovation bonds, with eight banks having completed their issuances, including the China Development Bank, Industrial and Commercial Bank of China, Agricultural Bank of China, Bank of Communications, Industrial Bank, Shanghai Pudong Development Bank, Hangzhou Bank, and Bohai Bank. The total issuance scale of technology innovation bonds from the nine banks mentioned above will reach 120 billion yuan. Several banks have stated that the funds raised will be accurately directed towards the field of technology innovation, providing financial support for the growth and development of technology innovation enterprises. (Securities Daily)