The People's Bank of China's Shanghai headquarters is actively promoting the landing of the "technology board" in the bond market in Shanghai, with several enterprises included in the first batch of pilot projects nationwide.

The People's Bank of China and the China Securities Regulatory Commission jointly issued a notice on May 7 regarding supporting the issuance of technology innovation bonds, guiding long-term capital to invest early, invest in small amounts, invest for the long term, and invest in hard technology, promoting the establishment of a financial system that is compatible with technological innovation. With the strong support of the headquarters and the Shanghai Municipal Party Committee and Government, the People's Bank of China Shanghai Head Office, together with the Municipal Party Committee's Financial Office and other relevant departments, actively promoted the participation of private equity institutions, technology-based enterprises, and financial institutions in the first batch of technology innovation bond issuances nationwide in the Shanghai area. As of May 9, two technology-based enterprises and one equity investment institution in Shanghai have been included in the first batch of pilot projects nationwide. Among them, New Wei Technology Group successfully issued 200 million yuan of technology innovation bonds, with the funds raised directly used for equity investment in enterprises related to the integrated circuit industry. Since Governor Pan Gongsheng announced the launch of the "technology board" in the bond market during the Two Sessions period, the People's Bank of China Shanghai Head Office has taken multiple measures and diligently promoted the implementation of technology innovation bonds. Firstly, the relevant policies were promptly reported to the Shanghai Municipal Party Committee and Government to establish a special work mechanism led by Shanghai city leaders. Secondly, close communication and coordination with the Financial Office of the Municipal Party Committee, financial departments, and industry departments were established to build a reserve project library for technology innovation bonds and promote support through local risk sharing, interest subsidies, and other policies. Thirdly, communication with the exchange associations and credit enhancing agencies was strengthened to guide Shanghai's financial institutions to actively participate in the issuance and underwriting of technology innovation bonds, track progress dynamically, and assist issuers in resolving registration and issuance-related issues promptly. Next, the People's Bank of China Shanghai Head Office will further implement the support policies for technology innovation bonds from the headquarters in coordination with relevant departments, strengthen policy promotion, and continuously deepen and solidify implementation measures in accordance with the characteristics of regional financing subjects.