Huatai Securities (06886.HK) will issue technology innovation subordinated bonds (first tranche) to professional investors in 2025 with a coupon rate of 1.71%.

Zhtng Cijng APP news, Huatai Securities (06886.HK) issued an announcement, according to the "Huatai Securities Limited Company 2025 Open Issue of Technology Innovation Subordinated Bonds (First Tranche) Announcement for Professional Investors", Huatai Securities Limited Company 2025 Open Issue of Technology Innovation Subordinated Bonds (First Tranche) (referred to as "this bond") has a term of 3 years, with a face interest rate inquiry range of 1.5%-2.5%. The face interest rate of this bond will be negotiated within the inquiry range based on the results of the offline interest rate inquiry by the issuer and the lead underwriter.