Lates News

Industrial and Commercial Bank of China announced on May 9 that it became the first to launch the first batch of technology innovation bonds on that day. The launch event for technology innovation bonds, hosted by the China Interbank Market Dealers Association and organized by the Beijing Financial Assets Exchange, was held in Beijing on the same day, marking the official launch of technology innovation bonds in the interbank bond market. ICBC stated that the size of the technology innovation bonds issued this time, which amounted to 20 billion yuan, is the largest among the first batch of financial technology innovation bonds issued. Among the 36 technology-based enterprises and equity investment projects announced in the first batch of issuance, ICBC acted as the lead underwriter for 12 projects.