Shenzhen supports enterprises to actively issue technology innovation bonds.

On May 8th, the official website of the Securities Association indicated that 36 companies have announced the issuance of technology innovation bonds, with a total issuance size of 21 billion yuan. Shenzhen supports companies actively issuing technology innovation bonds, with two companies listed in the first batch of technology innovation bond issuers. Among them, Luxshare Precision Industry Co., Ltd. plans to issue 1 billion yuan of technology innovation bonds, the proceeds of which will be used to optimize the company's debt structure, supplement the company's operating funds, and empower the construction of high-end intelligent manufacturing bases and the upgrade of digital manufacturing. Shenzhen Investment Holdings Co., Ltd. plans to issue a total of 1 billion yuan of technology innovation bonds, with durations of 3 years and 10 years respectively. The funds raised will be used specifically for capital contributions to its subsidiary funds, investing in the fields of intelligent manufacturing, high-end equipment, semiconductors and integrated circuits, AI and embodied robots, and other technology innovation areas, accurately matching the demands for "early investment, small investment, and long-term investment".