The first batch of innovative bonds issuance list revealed 2 Shenzhen companies appeared.

The construction of the "technology board" in the bond market has made new progress. Following the announcement yesterday of the innovative launch of technology innovation bonds in the interbank market, today, the first batch of issuers of technology and innovation bonds has been disclosed on the official website of the China Interbank Market Dealers Association. As of the time of writing, there are 27 issuers involved, with 2 Shenzhen companies among them. Among them, Luxshare Precision plans to issue 1 billion yuan of technology and innovation bonds, with the proceeds to be used to optimize the company's debt structure, supplement operational funds, and empower the construction of high-end intelligent manufacturing bases and digital manufacturing upgrades. Shenzhen Investment Holdings plans to issue a total of 1 billion yuan of technology innovation bonds, with the funds raised to be specifically used to contribute to its parent fund, and invest in the fields of intelligent manufacturing, high-end equipment, semiconductors and integrated circuits, AI and physical robots, new materials, new energy, and intelligent connected vehicles in the field of science and technology innovation.