TSMC expects to mass produce the SoW-X packaging system in 2027, with a computing power increase of 40 times.

TSMC will expand its advanced packaging CoWoS capacity and launch the SoW-X integrated system-level packaging this year, expected to enter mass production in 2027. The new product's mask size is increased by 9.5 times, providing a 40-fold increase in computational power compared to the current CoWoS solution.