Accelink Technologies' high-end optoelectronics and silicon photonics chip device industrialization project breaks ground.

On November 1, the groundbreaking ceremony for Accelink Technologies' high-end optoelectronics and silicon photonics chip device industrialization project was held at the Accelink Technologies high-end optoelectronics industrial base. The project covers a total area of approximately 35,000 square meters, with a planned total gross floor area of 166,300 square meters. It will include two high-grade cleanrooms, one intelligent warehousing and logistics center, one high-energy-efficiency facility power station, one employee center, and other ancillary facilities, with living amenities such as employee dormitories built concurrently. The project will continuously introduce world-class advanced processes and automated equipment to enhance the R&D and large-scale manufacturing capabilities of high-end optoelectronics and silicon photonics chip devices.