Samsung Electronics Chairman Lee Jae-yong visits Japan to inspect advanced packaging technology, plans to invest 40 billion yen over 5 years

Samsung Electronics Chairman Lee Jae-yong visited the Advanced Packaging Lab (APL) in Yokohama, Japan, on the 1st to inspect the progress of R&D on next-generation semiconductor packaging materials and process technologies, and discussed strengthening cooperation with Japanese semiconductor materials, components, and equipment companies with local researchers. Samsung Electronics plans to invest 40 billion yen over the next five years starting in 2024 to build the Yokohama APL into a global advanced packaging R&D center, and plans to expand the local R&D workforce to more than 100 by 2027. The research areas will also be expanded to next-generation packaging technologies such as wafer bonding and glass substrates.