NVIDIA Discloses Next-Generation CPO Technology, Prototype Samples Already in Place

NVIDIA recently publicly demonstrated its next-generation co-packaged optics technology, called OOI, at SEMICON West 2026. Unlike existing CPO solutions, OOI chooses to eliminate the organic package substrate, integrating the optical engine directly onto the silicon interposer that carries the GPU, bringing the optical-electrical conversion stage even closer to the chip core and providing a new interconnect approach for next-generation hyperscale AI clusters. According to Nikola Nedovic, Principal Research Scientist at NVIDIA Research, the solution replaces the current organic package substrate with a larger-area interposer, and NVIDIA has already obtained prototype samples.