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On September 22, at the 2026 Hangzhou Yunqi Conference, T-Head announced its roadmap for the Yitian server CPU. In 2027, it will launch two generations of server CPUs, the Yitian 720 and Yitian 730, with continuous improvement in single-core performance. In the future, T-Head will also continue to launch the Yitian 750 based on its second-generation self-developed core. This chip supports T-Head's self-developed ICN die-to-die interconnect bus protocol and can be directly interconnected with the Zhenwu AI chip through the ICN bus, further improving the collaboration efficiency between the CPU and AI chips to meet the computing power demands of the Agentic era. (Jiemian).
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