Yingxin Development: Plans to raise 1.779 billion yuan for semiconductor-related projects.

Yinxin Development announced that the company plans to issue shares to specific targets to raise no more than 1.779 billion yuan. After deducting issuance costs, 1.053 billion yuan will be used for advanced packaging and testing and storage module manufacturing projects, 206 million yuan for research and development of memory main control chips, and 520 million yuan to supplement working capital and repay bank loans. The first two projects will be implemented by the companys holding subsidiary, Changxing Semiconductor, and the company plans to promote this by providing loans to it. Before the raised funds are in place, the company may initially invest its own funds based on project schedules and later replace them according to regulations. If the actual net amount raised is less than the intended usage amount, the shortfall will be resolved by the companys own funds.