The message states that Samsung Electronics is developing "2.xD" packaging technology.

According to reports, Samsung is focusing on research and development of the "2.xD" packaging technology to address power consumption and heat dissipation issues. It is reported that 2.xD, based on existing silicon interposer packaging, integrates HBM, logic chips, and silicon photonics technology into a single system through the application of a panel-based redistribution layer interposer, and is expected to develop into a high-capacity, high-bandwidth system packaging for artificial intelligence data centers.