Samsung Electronics Exposes Details of HBM5, Expected to Adopt Copper-based HPB Cooling Technology, Expected to Achieve Mass Production in 2028.

Samsung Electronics plans to use its independently developed 2nm process to manufacture chips for HBM5 production, with mass production expected around 2028. HPB will be a core thermal management technology widely used in the chips. Specifically, HPB is a metal heat conduction structure integrated within the chip package, typically made of copper material, with heat conduction performance about 500 to 1000 times higher than polymer-based substrates, DAF, or EMC.