: Newly launched first Argus 3DIC physical verification platform, fully supporting 2.5D/3D heterogeneous integrated packaging design.

Huada Jiutian replied in Interaction Easy that in the field of 3DIC, the company foresaw that current AI, GPU, storage chips and other chips are breaking through the advanced process and computing power bottlenecks of the post-Moore era based on 3DIC technology. It has advanced layout in the 3DIC design EDA field, constructing a full-process solution covering from heterogeneous integrated 3D chip collaborative design to verification, filling the gap in high-end 3DIC design tools in China, and is the only domestic 3DIC design verification full-process EDA provider. The company has newly launched the industry-leading Argus 3DIC physical verification platform, which fully supports 2.5D/3D heterogeneous integrated packaging design, and can achieve full-link physical verification from 3DIC diversified collaborative design to packaging.